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Aluminum Heatsink 20×14×6mm — Adhesive Cooling Fin for IC, Raspberry Pi, SSD & 3D Printer
Aluminum Heatsink 20×14×6mm Adhesive Cooling Fin for IC, Raspberry Pi, SSD & 3D Printer
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Aluminum Heatsink 20×14×6mm — Adhesive Cooling Fin for IC, Raspberry Pi & SSD
This 20×14×6mm aluminum heatsink is a compact, finned heat dissipator designed for direct attachment to IC chips, SoCs, MOSFETs, voltage regulators, NVMe SSDs, and 3D printer stepper motor drivers. The pre-applied thermal adhesive pad on the base provides both thermal contact and mechanical attachment in a single step — no thermal paste or separate adhesive required. Available in five anodized colors to match your build aesthetic.
Key Specifications
| Parameter | Value |
|---|---|
| Dimensions | 20mm × 14mm × 6mm (L×W×H) |
| Material | Aluminum alloy (anodized) |
| Color Options | Black / Silver / Gold / Red / Green |
| Attachment | Pre-applied thermal adhesive pad (peel-and-stick) |
| Fin Design | Parallel fins for natural convection airflow |
| Thermal Conductivity | Aluminum: ~200 W/m·K |
| Compatible Devices | IC chips, Raspberry Pi, NVMe SSD, MOSFET, stepper drivers |
| Origin | CN |
Typical Fit Guide
| Device | Recommended Use |
|---|---|
| Raspberry Pi 4 / 5 SoC (BCM2711/BCM2712) | Direct fit on SoC package; reduces throttling under sustained load |
| NVMe M.2 SSD controller | Attach to controller IC to reduce thermal throttling |
| 3D printer stepper driver (A4988, DRV8825, TMC2209) | Attach to driver IC; reduces heat at high current settings |
| MOSFET / voltage regulator (TO-220, D2PAK) | Attach to package top for supplemental cooling |
| ESP32 / ESP8266 module | Attach to SoC for passive cooling in enclosed enclosures |
Why Use a Heatsink?
- Prevent thermal throttling — CPUs, SoCs, and SSDs reduce clock speed when they overheat; a heatsink maintains full performance under sustained load
- Extend component life — Every 10°C reduction in junction temperature approximately doubles semiconductor lifespan
- Peel-and-stick installation — Pre-applied thermal adhesive pad; clean the surface, peel the liner, press and hold for 30 seconds
- 5 color options — Match your Raspberry Pi case, PCB color, or build theme
Frequently Asked Questions
Q: Is the thermal adhesive pad removable?
The adhesive pad provides a permanent bond for most surfaces. Removal is possible with gentle heat (hair dryer at low setting) and isopropyl alcohol to dissolve residue, but may leave marks on sensitive surfaces. For temporary attachment, use thermal tape instead.
Q: Does this fit the Raspberry Pi 5?
The 20×14mm footprint fits the BCM2712 SoC on the Raspberry Pi 5. For full active cooling on the Pi 5, Raspberry Pi’s official active cooler is recommended. This heatsink provides supplemental passive cooling for light to moderate workloads.
Package Contents
- 1× Aluminum heatsink 20×14×6mm with pre-applied thermal adhesive pad (color per selected variant)
