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951 Flux Pen — 10ml No-Clean Low-Solid Rosin
The 951 Flux Pen is a low-solid, no-clean rosin flux in a convenient pen applicator, ideal for PCB soldering, SMD rework, and through-hole repair. The fine tip delivers precise flux application exactly where needed — no mess, no waste. The no-clean formula leaves minimal residue that is non-corrosive and non-conductive, so cleaning is optional for most applications.
Key Specifications
| Parameter | Value |
|---|---|
| Volume | 10ml |
| Flux Type | Low-solid rosin (no-clean) |
| Residue | Minimal, non-corrosive, non-conductive |
| Cleaning Required | No (optional for cosmetic purposes) |
| Applicator | Pen with fine tip |
| Activation Temperature | ~183°C (solder melting point) |
| Halide Content | Halide-free |
| Compatible Solders | Sn63/Pb37, SAC305, Sn99.3/Cu0.7 |
Why Choose 951 Flux Pen?
- ✅ No-clean formula — residue is non-corrosive and non-conductive, no cleaning needed
- ✅ Pen applicator — precise tip application, no brush or syringe needed
- ✅ Low-solid content — minimal residue for clean, professional-looking solder joints
- ✅ Halide-free — safe for sensitive components and gold-plated contacts
- ✅ Works with all solder types — leaded, lead-free, and silver-bearing solders
Compatible With / Works With
- SMD component soldering (0402, 0603, 0805, SOT-23, SOP, QFP packages)
- Through-hole component soldering and repair
- BGA rework (apply to pads before reflow)
- Wire tinning and connector soldering
- All soldering irons and hot air rework stations
Typical Applications
- SMD Soldering — apply to pads before placing and soldering SMD components
- PCB Rework — reflow cold joints and improve solder flow on existing joints
- Through-Hole Repair — improve solder wetting on oxidized through-hole pads
- Wire Tinning — tin stranded wire ends for reliable solder connections
- Connector Soldering — JST, DuPont, USB connector pin soldering
How to Use
- Remove cap and press tip gently on a surface to saturate the felt tip with flux
- Apply flux to PCB pads, component leads, or wire ends
- Solder immediately while flux is active
- Residue can be left (no-clean) or removed with IPA (isopropyl alcohol) for cosmetic finish
- Replace cap after use to prevent evaporation
FAQ
Q: Does 951 flux pen residue need to be cleaned?
A: No. The no-clean formula leaves a non-corrosive, non-conductive residue safe to leave on the PCB. For cosmetic purposes or conformal coating adhesion, clean with 99% isopropyl alcohol (IPA) and a brush.
Q: Is 951 flux compatible with lead-free solder?
A: Yes. 951 flux activates at standard solder melting temperatures and works with SAC305 (Sn96.5/Ag3/Cu0.5) and other lead-free alloys. Increase iron temperature by 20–30°C for lead-free soldering.
Q: How do I prevent the pen tip from drying out?
A: Always replace the cap immediately after use. Store horizontally or tip-down. If the tip dries, press firmly on a surface to re-saturate from the reservoir, or briefly dip the tip in IPA to rehydrate.
Package Contents
- 1× 951 Flux Pen 10ml — No-Clean Low-Solid Rosin


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