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Keszoox

PCB & PCBA Assembly Service — Turnkey PCB Fabrication, SMT Assembly & Electronic Component Sourcing

PCB & PCBA Assembly Service Turnkey PCB Fabrication, SMT Assembly & Electronic Component Sourcing

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PCB & PCBA Assembly Service — From Bare Board to Fully Tested Assembly, One Supplier

Keszoox delivers a complete turnkey PCB and PCBA solution — from bare board fabrication and component sourcing through SMT placement, reflow soldering, through-hole assembly, functional testing, and global shipment. Whether you need a 5-piece prototype or a 50,000-unit production run, our vertically integrated manufacturing capability and in-house component warehouse eliminate the coordination overhead of managing multiple vendors. One RFQ, one purchase order, one delivery.


Service Overview — Four Tiers of PCB & PCBA Support

Service Tier What's Included Typical Lead Time Best For
PCB Fabrication Only Bare board manufacturing to your Gerber files; FR4, Rogers, aluminum, flex, rigid-flex 3–7 days Engineers who source and assemble components themselves
Partial Turnkey PCBA PCB fabrication + SMT/THT assembly; customer supplies components 5–10 days Teams with existing component inventory
Full Turnkey PCBA PCB fabrication + full component sourcing + assembly + testing 7–15 days Startups, NPI teams, and production buyers who want zero procurement overhead
Box Build / System Integration Full turnkey PCBA + enclosure assembly, cable harness, final system test 10–20 days OEM and ODM customers requiring complete finished units

PCB Fabrication Capabilities

Board Materials & Layer Count

Parameter Standard Capability Advanced Capability
Layer count 1–8 layers Up to 32 layers
Board material FR4 (Tg 130–170°C) Rogers 4003C/4350B, polyimide, aluminum, PTFE
Board thickness 0.4mm – 3.2mm 0.2mm – 6.0mm
Copper weight 1 oz (35µm) 0.5 oz – 6 oz (17µm – 210µm)
Min trace / space 4 mil / 4 mil 2 mil / 2 mil (HDI)
Min drill size 0.3mm mechanical 0.1mm laser (blind/buried via)
Surface finish HASL (lead-free), ENIG ENEPIG, OSP, immersion silver, immersion tin, hard gold
Solder mask Green, red, blue, black, white, yellow Matte black, matte green, transparent
Silkscreen White, black Any color on request
Special features Controlled impedance, back-drill Embedded components, via-in-pad, cavity board

Flex & Rigid-Flex PCB

  • 🟡 Flexible PCB (FPC) — Polyimide base; 1–4 layers; min bend radius 1mm; ZIF connector compatible
  • 🟠 Rigid-flex PCB — Combined rigid FR4 and flexible polyimide zones; up to 8 layers; ideal for wearables, aerospace, and medical devices
  • 🔵 Aluminum-base PCB — 1–2 layers; 1W/m·K – 3W/m·K thermal conductivity; LED lighting and power electronics

SMT & Through-Hole Assembly Capabilities

Assembly Type Capability Notes
SMT placement 0201 (0.6×0.3mm) to large QFP/BGA High-speed pick-and-place; ±25µm placement accuracy
BGA / µBGA Pitch ≥ 0.3mm; X-ray inspection standard Rework station available for BGA replacement
QFN / LGA Exposed pad packages; AOI + X-ray verification Void rate < 5% on thermal pads
Through-hole (THT) Manual and wave soldering; axial, radial, DIP, connectors Mixed SMT+THT boards supported
Press-fit connectors Controlled press-fit insertion force Backplane and high-reliability connectors
Conformal coating Acrylic, silicone, polyurethane, epoxy Selective or full-board coating; IPC-A-610 Class 2/3

Soldering Processes

  • 🔥 Lead-free reflow soldering — SAC305 solder paste; nitrogen atmosphere available; peak temperature profile per IPC-7711
  • 🌊 Wave soldering — Lead-free wave; selective wave for mixed assemblies
  • 🔬 Selective soldering — Robotic selective soldering for through-hole components on SMT-populated boards
  • Hand soldering — IPC-certified technicians; fine-pitch rework; BGA reballing

Component Sourcing for PCBA — Integrated with Our Warehouse

Unlike pure EMS providers who outsource component procurement, Keszoox operates its own component warehouse stocking millions of part numbers — IC chips, passive components, connectors, MOSFETs, and power management ICs. This means:

  • Faster BOM fulfillment — Most components shipped from our own stock; no waiting for distributor lead times
  • 💰 Lower total cost — Direct stock eliminates distributor markup on common components
  • 🔍 Verified authenticity — Every component passes our incoming QC before placement; zero counterfeit risk
  • 📄 Full traceability — Lot codes, date codes, and CoC documents for every component on your BOM
  • 🔄 Alternate sourcing — Hard-to-find or EOL components sourced through our global supply network
Component Category In-House Stock Sourcing Lead Time
IC chips (MCU, analog, logic, memory) Millions of part numbers Same day – 3 days
Passive components (R, C, L) All standard values and packages Same day
MOSFETs, transistors, diodes All common types and packages Same day – 2 days
Connectors (JST, Molex, DuPont, USB) Full range stocked Same day
Power management ICs (PMIC, DC-DC, LDO) Major brands stocked Same day – 3 days
Hard-to-find / EOL / allocated parts Global sourcing network 3–10 days

Quality Control — IPC-A-610 Compliant, Seven-Stage Inspection

Stage Method What It Catches
1. Incoming component inspection Visual + parametric testing on ATE Counterfeit, out-of-spec, wrong value/package
2. Solder paste inspection (SPI) 3D SPI machine; 100% coverage Insufficient paste, bridging, misalignment before placement
3. Post-placement inspection Vision system on pick-and-place Missing, misaligned, or wrong components before reflow
4. Automated optical inspection (AOI) Post-reflow AOI; top and bottom Solder bridges, tombstoning, missing components, polarity errors
5. X-ray inspection 2D/3D X-ray for BGA and QFN Hidden solder joints, voids, cold joints under packages
6. In-circuit test (ICT) Bed-of-nails or flying probe Open circuits, short circuits, wrong component values
7. Functional test (FCT) Customer-defined test fixture or JTAG Board-level functional verification against specification
  • 🏆 IPC-A-610 Class 2 standard — Default for commercial electronics
  • 🚗 IPC-A-610 Class 3 available — For automotive, medical, and aerospace applications
  • 📊 First Article Inspection (FAI) — Full dimensional and functional report on first production units
  • 🧾 Certificate of Conformance (CoC) — Included with every shipment

Why Choose Keszoox for PCB & PCBA?

# Advantage What It Means for You
01 Technical Datasheet & DFM Review Free Design for Manufacturability review on every new project — catch issues before production
02 100% Original Components All components sourced from authorized channels; zero-tolerance counterfeit policy; CoC included
03 PCB & PCBA Under One Roof Bare board fab and assembly in one facility — no inter-vendor delays, no finger-pointing
04 Chip Replacement & BOM Optimization We identify lower-cost or better-availability alternates for your BOM without compromising performance
05 In Stock Components, Fast Delivery Own warehouse eliminates component lead time; prototype delivery in as fast as 5 days
06 Strict 7-Stage QC SPI + AOI + X-ray + ICT + FCT — every board verified before shipment
07 Dedicated Technical Support Engineering team for DFM, DFT, component selection, and production ramp support
08 After-Sales & Warranty Full replacement guarantee; dedicated account manager; post-delivery technical support

How to Get a Quote — Three Steps

  1. Send Your Files — Gerber files (RS-274X), BOM (Excel/CSV), pick-and-place file, and any special requirements
  2. Receive Your Quote — Detailed quote within 24 hours covering PCB fabrication, component costs, assembly, and shipping
  3. Approve & We Build — Confirm the order; we procure, fabricate, assemble, test, and ship — with full tracking
Project Type Quantity Typical Lead Time Service
Prototype 1–10 pcs 5–7 days Full turnkey; expedite available
NPI / Pilot 10–100 pcs 7–12 days Full turnkey + FAI report
Small production 100–1,000 pcs 10–15 days Full turnkey + ICT + FCT
Volume production 1,000–50,000 pcs 15–25 days Dedicated line + VMI + CoC

Industries Served

Industry Typical PCBA Projects Key Requirements
Consumer Electronics IoT modules, smart home devices, wearables, audio equipment Cost efficiency, fast NPI, compact form factor
Industrial Automation PLC boards, motor controllers, HMI panels, sensor modules IPC Class 2/3, wide temperature range, long lifecycle
Automotive Electronics ECU boards, ADAS modules, EV battery management systems AEC-Q100/Q200 components, IATF 16949, PPAP
Medical Devices Patient monitoring, diagnostic equipment, implantable device boards IPC Class 3, ISO 13485, full traceability
Telecommunications 5G base station boards, optical transceiver modules, routers High-frequency PCB, controlled impedance, BGA assembly
Aerospace & Defense Avionics boards, radar modules, satellite subsystems MIL-spec, IPC Class 3, hermetic packaging

Frequently Asked Questions

What files do I need to submit for a PCBA quote?

You need: Gerber files (RS-274X format), a BOM in Excel or CSV (with part numbers, quantities, and reference designators), and a pick-and-place (centroid) file. Assembly drawings and special instructions are helpful but not mandatory for a preliminary quote.

Can you do a DFM review before production?

Yes. Every new project receives a free Design for Manufacturability (DFM) review. We check pad sizes, clearances, component orientation, panelization, and testability before cutting a single board.

Do you support mixed SMT and through-hole assemblies?

Yes. We handle mixed technology boards with SMT on one or both sides plus through-hole components, using a combination of reflow, wave, and selective soldering as required by the design.

Can you source components for my BOM if I don't have them?

Yes. Full turnkey service includes complete component sourcing from our own warehouse and global supply network. We also offer BOM optimization — identifying lower-cost or better-availability alternates for hard-to-find parts.

What is your minimum order quantity for PCBA?

MOQ is 1 piece for prototype assembly. No artificial MOQ for R&D and NPI projects. Volume pricing applies from 100 pieces upward.

Do you offer functional testing?

Yes. We support ICT (in-circuit test) with bed-of-nails or flying probe fixtures, and functional test (FCT) using customer-supplied test fixtures or JTAG boundary scan. Test coverage report included.

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