Adapts 20-pin SOIC and TSSOP packages to 0.6″ DIP footprint
DESCRIPTION
These adapters have an ENIG finish and can mount a 20-pin SOIC-20 IC on one side or a TSSOP-20 IC on the other side and convert it to a 0.6″ wide DIP-20 footprint.
PACKAGE INCLUDES:
- Qty 5 – PCB, SOIC/TSSOP-20 to DIP Adapter, ENIG
KEY FEATURES OF PCB, SOIC/TSSOP-20 TO DIP ADAPTER:
- Mounts SOIC-20, TSSOP-20 and similar package types
- ENIG (Electroless Nickel Immersion Gold) finish
- Trace width 0.010″ with 0.020″ width on corner pins
- 1.6mm / 0.62″ FR-4 construction
This adapter board can mount 20-pin SMD components that either have a 0.65mm or a 1.27mm lead spacing and convert it to a 20-pin 0.6″ DIP footprint with pins on 2.54mm (0.1″)centers for use with breadboards, perf boards and IC sockets. It is designed for SOIC-20 and TSSOP-20 packages, but it may fit other packages such as SSOP that share the same lead pitch. Refer to the pad dimensions to determine suitability for mounting a particular package type.
You can also mount packages with fewer than 20 pins on the adapter, but keep in mind that the pinout will not be 1:1.
The board is double-sided to support the two different SMD pin pitches. The header pins can be soldered to either side of the board for use with breadboards and they can be inserted into sockets if desired.
The DIP footprint is 0.6″ centers. These boards can be used with standard straight male headers available separately or they can be ordered with high quality round machine pin headers that work especially well for inserting into sockets and can be used with the high quality round machine pin female sockets that come on break-away strips.
High Quality Finish
The boards are constructed of 1.6mm FR-4 with 1oz copper and green solder mask. A 0.010″ trace width is used with heavier duty 0.020″ traces on the corner pins which normally carry power and ground connections.
The copper has an ENIG (Electroless Nickel Immersion Gold) finish for maximum performance. ENIG ensures extended shelf life against corrosion and provides excellent solderability with lead or lead-free solder. It also provides a completely flat soldering surface which is important with surface mount ICs. It is also fully ROHS compliant.
Notes:
- None
TECHNICAL SPECIFICATIONS
| Material | FR-4 w/ green solder mask | |
| Plating | ENIG (Electroless Nickel Immersion Gold) | |
| Silkscreen | White, double-sided | |
| Dimensions | Board outline | 24.5 x 17.78mm (1.0 x 0.7″) |
| Board thickness | 1.6mm (0.062″) | |
| Header row spacing | 2.54mm (0.1″) pin-to-pin on 15.24mm (0.6″) centers | |
| Country of Origin | Designed in USA | Manufactured in China |
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