Solderless Breadboard 400 (Pro Series)

Features phosphor bronze contacts and is part of our Pro Series of products.

DESCRIPTION

The Solderless Breadboard 400 is a professional grade half-size solderless breadboard and part of our Pro Series of products.

PACKAGE INCLUDES:

• Solderless Breadboard 400 – Model: EIC-801

KEY FEATURES OF SOLDERLESS BREADBOARD 400 (PRO SERIES):

• Tie-points:  400
• Spring Contacts:  Fully embossed phosphor bronze
• Color:  Off-white
• Power Rails:  Full length continuity
• Recommended Insertion Range:  21-26 AWG

Solderless breadboards are used for prototyping electronic circuits by inserting components and wires into spring contacts.  This allows circuits to be easily and quickly constructed without soldering.  It also allows components to be reused multiple times in different circuits.

With 400 tie-points, this size of breadboard is good for smaller projects.

Refer to our Guide To Solderless Breadboards for a detailed description of solderless breadboards including their cost and performance trade-offs.

OUR SOLDERLESS BREADBOARD PRODUCT LINES

Hobby Line of products are constructed to hobby standards using stainless steel spring contacts for good price/performance where cost is the major consideration for selection.

Pro Series of products are constructed to professional standards using high quality plastic moldings with phosphor bronze spring contacts for applications where optimum performance is the major consideration for selection.

Notes: 

1. These are designed to work with components such as IC’s which have standard 0.1″ spacing.  Components with other lead spacing such as 2mm may work if the leads can be reformed to fit the 2.54mm  pitch of the breadboard

TECHNICAL SPECIFICATIONS