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Solderless Clear Breadboard 830 (Pro Series)

Solderless Clear Breadboard 830 (Pro Series)

Regular price $8.95 USD
Regular price $11.95 USD Sale price $8.95 USD
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Features phosphor bronze contacts and is part of our Pro Series of products.

DESCRIPTION

The Solderless Clear Breadboard 830 is a professional grade solderless breadboard that features phosphor bronze contacts and is part of our Pro Series of products.

PACKAGE INCLUDES:

  • Solderless Breadboard 830 – Model: EIC-1302
  • Aluminum backing plate

KEY FEATURES OF SOLDERLESS BREADBOARD 830 (PRO SERIES):

  • Tie-points:  830
  • Spring Contacts:  Fully embossed phosphor bronze
  • Color:  Clear / transparent
  • Power Rails:  Full length continuity
  • Recommended Insertion Range:  21-26 AWG
  • Optional aluminum backing plate included

Solderless breadboards are used for prototyping electronic circuits by inserting components and wires into spring contacts.  This allows circuits to be easily and quickly constructed without soldering.  It also allows components to be reused multiple times in different circuits.

With 830 tie-points, this size of breadboard is good for small to medium projects.

The breadboard can be used as-is.  It also has an adhesive back that allows it to be permanently mounted to a substrate if desired.  It also ships with a thin aluminum plate that can be adhered to the back of the breadboard if it is desired to add a ground plane of some sort.

Refer to our Guide To Solderless Breadboards for a detailed description of solderless breadboards including their cost and performance trade-offs.

OUR SOLDERLESS BREADBOARD PRODUCT LINES

Hobby Line of products are constructed to hobby standards using stainless steel spring contacts for good price/performance where cost is the major consideration for selection.

Pro Series of products are constructed to professional standards using high quality plastic moldings with phosphor bronze spring contacts for applications where optimum performance is the major consideration for selection.

Notes: 

  1. These are designed to work with components such as IC’s which have standard 0.1″ spacing.  Components with other lead spacing such as 2mm may work if the leads can be reformed to fit the 2.54mm  pitch of the breadboard

TECHNICAL SPECIFICATIONS

Mfr Model Number EIC-1302
Tie-points 830
Spring Contacts Material  Phosphor bronze w/ silver nickle plating
Design  Fully embossed
Power Rails x2  Full length continuity
Housing Material  ABS plastic
Color  Clear / transparent
Lead Openings  Square hole
Conductor Gauge  For making interconnects 21-26AWG
Grid Spacing  Adjacent tie-points  0.1″ (2.54mm)
 Dimensions  165 x 55 x 8.5mm (6.5 x 2.2 x 0.34″)
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